发明名称 |
Thermally conductive printed wiring board laminate |
摘要 |
A printed wiring board laminate is disclosed that is particularly suitable for use with leadless surface mounted devices such as ceramic chip carries. The laminate combines a low coefficient of thermal expansion in the X-Y direction with thermal conductivity. In one embodiment, the laminate comprises a support fabricated from graphite fiber reinforced metal adhesively secured to a printed wiring board fabricated from dielectric (e.g., glass) fiber reinforced resin. The support has an X-Y coefficient of thermal expansion less than about 4 ppm/ DEG C., and the printed wiring board has a coefficient of thermal expansion greater than about 10 ppm/ DEG C. In a second embodiment, the support comprises a core of graphite fiber reinforced metal or resin sandwiched between two metal sheets.
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申请公布号 |
US4609586(A) |
申请公布日期 |
1986.09.02 |
申请号 |
US19840637111 |
申请日期 |
1984.08.02 |
申请人 |
THE BOEING COMPANY |
发明人 |
JENSEN, WARREN M.;WILKINSON, WILLIAM C. |
分类号 |
H05K1/05;H05K3/00;H05K3/38;H05K3/42;H05K3/44;H05K3/46;(IPC1-7):B05D5/12 |
主分类号 |
H05K1/05 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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