LIQUID FLOW-DOWN TYPE PLATING METHOD

摘要

PURPOSE:To attain the speed-up of the plating by providing a material to be treated in a plating liquid flow which is stirred by the synthesis of both the plating liquid flow in the axial direction of a liquid duct and the plating liquid flow in the direction rectangular thereto and plating it. CONSTITUTION:A liquid duct 18 is constituted of a flow path wall 3 provided to the inside of the first plating vessel 1 and a stirring flow 8 of the specified pressure is fed in the inside of the liquid duct 18 from a bottom of the liquid duct 18. Simultaneously the injection flows 9 are fed in the direction nearly rectangular to the stirring flow 8 by providing the injection holes 5 for a plating soln. in the neighborhood of the flow path wall 3. The plating liquid flow 10 synthesized by both the stirring flow 8 and the injection flows 9 is formed by such a way and a material 15 to be plated is provided in the plating liquid flow 8.