发明名称 SOLDERING METHOD
摘要 PURPOSE:To obtain the high reliability in soldering and the stability at mass production time by heating in advance with using auxiliary heating device in the soldering method to cut off the welding after detecting the solder melt by measuring the displacement between the materials to be welded. CONSTITUTION:A substrate 1 is heated in advance to the prescribed temp. by a hot plate 19 and the conductive wire 2, solder 4 and lead wire 3 on the substrate 1 become in high temp. state as well. A pulse current is passed to melt the solder 4 after abutting electrodes 5, 6 to the lead wire 3 with pressurizing with this state. In this case, the gap length between the materials to be welded is measured on each a fixed time by a displacement gage 9 and the welding is stopped by a control unit 13 at the time when the total displacement quantity reaches the prescribed value after the solder 4 being melted. The melted solder 4 is adapted well to the surface of the conductive wire 2 and lead wire 3 in spite of the welding between the electrodes 5, 6 being stopped by the preheating of the hot plate 19 and good soldering is performed.
申请公布号 JPS61195779(A) 申请公布日期 1986.08.30
申请号 JP19850036933 申请日期 1985.02.26
申请人 MITSUBISHI ELECTRIC CORP 发明人 SAITO TAKASHI
分类号 B23K31/02;H05K3/34 主分类号 B23K31/02
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