发明名称 HEAT TREATMENT DEVICE USING SCANNING ELECTRON BEAM
摘要 <p>PURPOSE:To enable to freely change the direction of heat treatment to be performed on a sample as well as to eliminate the effect on the sample caused by the return of an electron beam after the heat treatment is finished by a method wherein a ring- shaped blanking target is provided on the circumference of the passage of the electron beam which is made to irradiate on the sample or the circumference of the sample. CONSTITUTION:An electron beam 3 is emitted from an electron gun 2, a DC deflection input is given to a deflector 4 from a deflection power source 5 in advance, the electron beam 3 is substantially deflected and projected on a blanking target 8. A heat treatment is performed on the prescribed regions of the sample successively by scanning the electron beam such as the electron beam 21 as shown by means of A-A in the diagram and by changing the deflection input sent from the deflection power source after the acceleration voltage of the electron beam and the beam current are stabilized. As the electron beam is scanned on the sample after the acceleration voltage of the electron beam and the beam and the beam current are turned to a stationary state as above-mentioned, a heat treatment can be performed uniformly in excellent reproducible manner, and also the direction of heat treatment can be arbitrary selected from any direction in 360 deg. for the sample.</p>
申请公布号 JPS61196514(A) 申请公布日期 1986.08.30
申请号 JP19850036888 申请日期 1985.02.26
申请人 NEC CORP 发明人 NAKAMURA TSUYOSHI;KAWASE YUTAKA;SAITO SHUICHI
分类号 H01J37/30;H01L21/20;H01L21/263 主分类号 H01J37/30
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