| 摘要 |
<p>PURPOSE:To prevent load from applying to a chip, etc., even if liquid metal serving as a heat conducting medium is frozen, by housing the other liquid metal with a higher melting point than the liquid metal, in a good heat conducting vessel having holes bored through it. CONSTITUTION:Vessels 12 for housing liquid metal 13 therein are mounted through the upper plate of a cooling container 16, and pins 15 being mounted to the surface of a ceramic base plate 5 are inserted into the holes of the vessels 12. The liquid metal 13 has a higher melting point than that of liquid metal 11. Before the liquid metal 11 is freezed to apply stress to a chip 4, etc., the liquid metal 13 is earlier freezed. At this time, the resulted stress pushes up the pins 15 as well as the ceramic base plate 5 so that the chip 4 can not contact with the liquid metal 11. As a result, load can not be applied to the chip 4 even if the liquid metal 11 is frozen.</p> |
