| 摘要 |
PURPOSE:To enable to set freely positions of input and output signal pins and to attain conversion of electric characteristics and logical operation, etc., by defining a place for mounting a logical semiconductor block in the course from the chip to leads. CONSTITUTION:Lead frames 6, 6... are taken out of pin sockets PA0, PA1, PA2, PA3 into which leads of a semiconductor logical integrated circuit can be inserted, on the LSI package. Signal lines CA0, CA1, CA2,...CA7 of the LSI on the lead side are connected to pin sockets OA0, OA1, OA2,...OA7 by means of lead frames 11, 11.... The pin sockets OA0, OA1... are arrayed so that the semiconductor logical integrated circuit can be inserted onto the LSI package cage. In such a structure, employing a programmable PLA device as the logical semiconductor device to be put thereon, this device is flexible to hardware alteration such as logical alteration. |
