SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PURPOSE:To reduce the chance of direct contact between a wire and a pellet even if the wire hangs down by putting an insulation material around the outside of a main surface of the pellet. CONSTITUTION:An insulation tape 13 is put around the outside of a main surface of a pellet 10 and protrudes from the main surface of the pellet 10. Even if an impact is applied to a lead frame after the wire bonding process to make the wire 11 hang down, the wire 11 gets contact with the tape 13. With this constitution, the chance of short circuit between the pellet 10 and the wire 11 is reduced.