发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
摘要 PURPOSE:To avoid short circuit between leads or between electrodes caused by free movement of fine foreign substances by a method wherein an internal surface of a cavity of a package is coated with a material substantially same as a sealing material when a pellet is airtightly sealed. CONSTITUTION:An internal bottom surface 11a of a cap 11 is coated with low melting point glass 12 which is the same material as a sealing material by a method such as coating. The cap 11 and a substrate 2 are put into a sealing furnace while being placed on a jig. At that time, fine foreign substances 13 adhering to the surface of the pellet fall onto the glass 12 applied on the bottom surface 11a. After heating, the substrate 2 and the cap 11 are taken out of the sealing furnace and cooled. The melted glass 12 is solidified and the airtight sealing of the inside of the package is achieved. With this constitution, short circuit between leads 6 or between electrodes caused by free movement of the foreign substances 13 is avoided.
申请公布号 JPS61194854(A) 申请公布日期 1986.08.29
申请号 JP19850034368 申请日期 1985.02.25
申请人 AKITA DENSHI KK;HITACHI LTD 发明人 MORIYA ATSUSHI
分类号 H01L23/04;H01L23/02;H01L23/10 主分类号 H01L23/04
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