发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF AND LEAD FRAME FOR THE MANUFACTURE
摘要 PURPOSE:To make an exposed fitting surface of a header by a method wherein a circumference edge of a backside of a substrate corresponding to the part of the substrate covered with resin is recessed by one step and the resin flowing round to the backside of the header is stored in a space of the recessed part. CONSTITUTION:A recessed part 7 is provided on a circumference edge of a backside surface corresponding to a part of a main surface of a header 1 molded with resin. After molding, the recessed part 7 and a package 3 form a groove 8. The groove 8 is utilized as a resin storage where the resin creeping to the backside of the header 1 during resin molding is stored. With this constitution, even if resin flush is produced, it is stored in the recess 7 and does not flow over the recess 7 to spread on the wide flat surface of the header 1 which is to be the fitting surface.
申请公布号 JPS61194858(A) 申请公布日期 1986.08.29
申请号 JP19850034350 申请日期 1985.02.25
申请人 HITACHI LTD 发明人 YAMAGUCHI MASAO;TANAKA NOBUKATSU
分类号 H01L23/48;H01L23/28;H01L23/31;H01L23/495 主分类号 H01L23/48
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