| 摘要 |
PURPOSE:To obtain an insulated type semiconductor device, whose mounting work is facilitated, by molding the header main surface side, to which a chip is fitted, with a resin and forming an insulating coating film on an exposed backside of header. CONSTITUTION:When a transistor is assembled by using a lead frame 8, a chip 2 is fixed in a chip fitting region 12 for the lead frame 8 first. Electrodes for the chip 2 and each lead 4 are connected by wires 7. The lead frame 8 is held between a top force and a bottom force for a molding die, and molded with a resin. An insulating coating film 5 is shaped on the back side of a header 1, the whole regions of the backs of the header 1 and a package 3, and an unnecessitated frame section 9 and a am piece 10 are cut and removed, thus manufacturing an insulated type semiconductor device. The coating film 5 is formed in such a manner that a resin such as epoxy resin is printed on the backside of the header 1 and the package 3 through a screen printing method, and cured for 3-6hr at a temperature of 180-250 deg.C. |
