| 摘要 |
PURPOSE:To remove normal post-processes, and to reduce manufacturing processes by manufacturing a glass sealing type semiconductor device by using a lead frame on which a metal, which is difficult to be oxidized at the sealing temperature of a package and has excellent solderability, is applied previously. CONSTITUTION:In a semiconductor device, a nickel-tin alloy is applied on the whole surface of a lead 4 with the exception of a bonding section 7 formed by applying aluminum to an inner end section. Lead itself consists of a 42 alloy. A semiconductor device is manufactured easily through a normal process by preparing a lead frame in which metallic layers 8 composed of the nickel-tin alloy area applied previously to predetermined sections. With the nickel-tin alloy, itself has superior solderability, and it has properties in which it is difficult to be oxidized even at the glass sealing temperature of a package such as 450 deg.C. Accordingly, the surface treating of external leads for improving solderability on mounting after normal glass sealing-that is, a post process is unnecessitated, thus attaining the reduction of the number of processes. |
