发明名称 NON-AQUEOUS DISPERSIONS OF RELATIVELY HIGH MOLECULAR WEIGHT EPOXY RESINS
摘要 <p>Non-aqueous dispersions which contain (A) an epoxy resin having an average epoxy equivalent weight of at least 475 and a Durran's softening point of at least 70oC, (B) a non-aqueous dispersion medium, and (C) a dispersant such as a copolymer of (1) at least one polymerizable ethylenically unsaturated monomer containing a group reactive with an epoxy group and (2) at least one polymerizable ethylenically unsaturated monomer free of any groups reactive with an epoxy group. These dispersions are useful in coatings, electrical or structural laminates or composites, body solders, adhesives, caulking compounds, casting compounds, filament winding and the like.</p>
申请公布号 WO1986004902(A1) 申请公布日期 1986.08.28
申请号 US1986000343 申请日期 1986.02.18
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