| 摘要 |
PURPOSE:To obtain a semiconductor device that is easy in development of a debug device, by alternatively selecting the signal fetched from a control signal generation circuit for debug and sealing the pellet after the connection is performed, being of construction mounted with pellets. CONSTITUTION:After having formed the specified circuit to a semiconductor wafer made of silicon together with a control signal generation circuit 6 for debug, the wafer is split, and the pellet 3 is obtained. A bonding pad 10a and a wiring 12 are executed so that an output terminal in the circuit 6 is connectable with an external lead. The pellet 3 is mounted by a gold or silver paste 8 at the bottom of a recess made at the center of substrate 2 of ceramics, etc. In the periphery of the recess on the substrate 2 a lead 9 is mounted by a low-melting point glass 5a, and a lead 9 is connected to a bonding pad 10 installed on the pellet 3 by a gold or similar wire 11. In case the semiconductor unit is used to a microprocessor unit, the wire bonding of the pad 10a and a lead 9a is unnecessary, and the substrate 2 is hermetically sealed by an aluminum cap 4. |
