发明名称 AUTOMATIC SOLDERING APPARATUS
摘要 <p>An automatic soldering apparatus, in which a base portion of a holder (23) extending a free end portion (soldering nozzle) (30) of a feed tube (10), which is used to guide a wire solder (22), toward a free end of a trowel tip (9) and supporting the free end portion (30) in the vicinity of the tip (9) is held on base plates (24, 54), which can be lowered and positioned with respect to this tip (9), via a spring, and tilted longitudinally, laterally and diagonally with respect to the tip (9) depending or how far a plurality of adjusting screws provided on the base plates (24, 54) project, whereby the wire solder (22) can be supplied to the trowel tip (9) in the desired positional relation therewith irrespective of the degree of wear of the trowel tip (9) in continuous use.</p>
申请公布号 WO1986004843(P1) 申请公布日期 1986.08.28
申请号 JP1985000083 申请日期 1985.02.25
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