| 摘要 |
PURPOSE:To accomplish bonding that allows wire coated with insulator to be safe from heat during the processing of semiconductor by a method wherein bonding is accomplished by cold pressure welding. CONSTITUTION:This is a process wherein wire with its surface coated with insulator is subjected to cold bonding. Such wire is first subjected to anodization whereby a corrosion-resisting oxide film is formed on its surface. The surface of an aliminum wire turns into porous gamma-Al2O3 after electrolysis in an electrolyte. The porous surface is exposed to boiling water and then superheated steam for sealing, which results in the formation of a boehmite coating. The boehmite-coated aluminum wire is guided through a capillary to land on a bonding spot where it is placed under pressure strong enough for cold pressure welding. The boehmite coating skin is destroyed during the cold pressure welding process for the exposure of fresh aluminum surfaces capable of strong bondage with each other under pressure. The capillary-housed boehmite-coated aluminum wire is then guided to another bonding spot for the next cold pressure welding process. |
