| 摘要 |
PURPOSE:To float a semiconductor substrate and a crystal substrate to be polished from a polishing tool so that they are held in a non-contact state by preventing a processing liquid from percolating by filling the inclined faces of V-shaped grooves to produce a dynamic pressure in the V-shaped grooves. CONSTITUTION:A processing liquid 23 including isolated grains 22 dispersed therein is supplied between a substrate 16 and a polishing tool 11 and the tool 11 is relatively moved toward the left hand with respect to the substrate 16. Since the surface of V-shaped grooves 18 is filled with a molten layer 20, a processing liquid 23 is prevented from percolating from inclined faces 19 into the inside of the polishing tool 11 to produce a regular dynamic pressure in the V-shaped grooves 18. Thus, the substrate 16 is floated from the surface of the tool 11 to the position where the dynamic pressure and a processing pressure are balanced with each other so that the substrate 16 is held in a non-contact state. On the other hand, since nonwoven fabrics 14 are exposed as they are on flat portions 17, isolated grains 22 are liable to be captured by pores 15 and among textiles of resin 12 and furthermore the processing liquid 23 is percolated thereto, the surface of the substrate 16 is polished with excellent efficiency. |
