发明名称 CURABLE COMPOSITION
摘要 <p>PURPOSE:The titled composition excellent in storage stability and curability, by mixing an epoxy resin with a specified compound with a surface-treated powder curing agent for epoxy resin. CONSTITUTION:100pts.wt. epoxy resin (A) having at least two epoxy groups in the molecule and a hydrolyzable chlorine content <=300ppm (e.g., bisphenol A diglycidyl ether) is mixed with 5-80pts.wt. at least one compound (B) selected from among a guanidine compound, an aromatic amine compound, a carboxylic acid anhydride compound and a hydrazide compound, 0.1-20pts.wt. compound (C) of an m.p. which is by 5-50 deg.C higher than that before coating, obtained by treating a powdered epoxy resin curing agent of an m.p. of 50-150 deg.C and a particle diameter <=50mu (e.g., m-phenylenediamine) with a surface-treating agent (e.g., tolylene diisocyanate) to form a 100-10,000Angstrom -thick film on the surface of the curing agent and, optionally, another curing agent, additives such as extender and reinforcement, an organic solvent, a (non)reactive diluent, etc.</p>
申请公布号 JPS61192722(A) 申请公布日期 1986.08.27
申请号 JP19850031439 申请日期 1985.02.21
申请人 ASAHI CHEM IND CO LTD 发明人 OTSUKA MASAHIKO;ISHIMURA SHUICHI;YAMAMURA HIDEO
分类号 C08G59/00;C08G59/18;C08G59/40;C08G59/50;C08G59/56 主分类号 C08G59/00
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