| 摘要 |
PURPOSE:To improve wiring reliability by ensuring a complete separation between two elements as well as the prevention of wirings from being disconnected owing to steps by a method wherein two neighboring elements are separated from each other by a groove and the leads of the two elements are connected over a pad bridging the groove. CONSTITUTION:Silicon island regions 3, 4 are separated from each other by a groove 6. A semiconductor device 20 is so formed that the opposing end portions of the silicon island regions 3, 4 are provided with bonding regions similar to each other. A bonding wore 10 running over a pad 11 is connected two wiring electrodes 9 for the establishment of connection of the two wiring electrodes 9 located on the two bonding regions provided with flat surfaces almost similar to each other. The wiring electrodes 9 connected in this way may be free of wiring disconnection caused by steps, with the surfaces of the opposing end portions of the silicon island regions 3, 4 being almost similar to each other. |
