| 摘要 |
PURPOSE:To secure the excellent heat dissipation and to prevent the application of a force to a lead provided between a terminal of a semiconductor component and a pad for the lead, by filling up a compound of high heat conduction around the semiconductor component mounted on the main body of a chip carrier. CONSTITUTION:The chip-mounting structure of chip carrier is composed of the chip carrier 1, a cap 2 and a compound 8 packed in the chip carrier 1. A pad 5 for a lead is formed inside the main body 1 of the chip carrier, while a pad 4 for input connected by a wire with the pad 5 for the lead is formed on the outside of the main body. On the main body 1 of the chip carrier a semiconductor component 7 is mounted with the top surface down, and the lend 6 is connected to the pad 5 for the lead, while the compound 8 of high heat conduction is packed inside the main body 1 of the chip carrier and sealed up with the cap 2. Accordingly, no stress acts on the semiconductor component 7, the cap 2 and the lead 6. |
