| 摘要 |
PURPOSE:To improve the pattern accuracy and to ensure the required film thickness by using a laminate film supporting the photosensitive substance film as one face of the base film and using the photo masking method to decide the remaining pattern of the absorbing body of the spurious surface acoustic wave. CONSTITUTION:The laminate film 13 supporting a low melting point photo sensitive substance film 12 having a prescribed film thickness on one face of a high melting point and transparent base film 11 is laminated to the entire face of a wafer 10 including transducers 2, 3 by using the film 12 as a press contact face. Since the laminated film 12 is coated and supported on the base film 11 in advance, the sufficient thickness to absorb the spurious surface acous tic wave is ensured. The film 12 is exposed by an ultraviolet ray via a photo mask placed on the film 11. The film 13 whose bonding force is deteriorated by the exposure is exfoliated from the film 11. Thus, the photo sensitive sub stance film of the remaining part acts like a spurious surface acoustic wave absorbing body.
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