发明名称 CONDUCTIVITY MODULATION TYPE SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
摘要 PURPOSE:To shorten turn-OFF time, by bonding a semiconductor layer showing the same conducting type and a semiconductor layer showing the different conducting type as a unitary body, forming a semiconductor substrate, and forming a conductivity modulation type semiconductor device. CONSTITUTION:A high concentration layer 12 of a second semiconductor layer is arranged in the neighborhood of a first semiconductor layer 11 having a one conducting type. Thus, a semiconductor substrate is formed. A reverse conducting type region 15 is formed in a one-conducting type region 14. A part of one surface of the semiconductor substrate is coated by an insulating layer 19. A gate layer 17 is embedded in the insulating layer 19. At this time a junction layer 32 is formed between the semiconductor layer 11 and the high concentration layer 12. Thus, the turn-OFF time can be shortened by about 1/5 in comparison with a conventional conductivity modulation type semiconductor device.
申请公布号 JPS61191071(A) 申请公布日期 1986.08.25
申请号 JP19850030577 申请日期 1985.02.20
申请人 TOSHIBA CORP 发明人 HIDESHIMA MAKOTO;TAKAHASHI WATARU;KUWABARA MASASHI
分类号 H01L29/78;H01L21/18;H01L21/331;H01L29/08;H01L29/68;H01L29/739 主分类号 H01L29/78
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