发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PURPOSE:To improve the adhesive property against a metal surface by incorporating to the titled composition, the compd. which is composed of a specific beta-diketone or its derivative shown by the formula and has >=70 deg.C b.p. CONSTITUTION:The titled composition is prepared by incorporating the beta- diketone or its derivative shown by the formula wherein R1 and R2 are each an alkyl, a phenyl, a substd. phenyl, a halogenated alkyl, an aryl or a teryl group, and having >=70 deg.C b.p. to the photosensitive resin comprising an ethylenically unsaturated compd., a binder polymer, a polymerization initiator. The additional amount of the beta-diketone or its derivative shown by the formula is 0.01-5wt%, preferably, 0.05-2wt% on the weight basis of the titled composition.
申请公布号 JPS61190330(A) 申请公布日期 1986.08.25
申请号 JP19850031843 申请日期 1985.02.20
申请人 DAICEL CHEM IND LTD 发明人 TAKENAKA FUMIO;ITO MASANORI;TOYA KOJI
分类号 G03C1/00;G03F7/085 主分类号 G03C1/00
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