发明名称 SOCKET FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To convert a test socket to a mounting socket readily, by forming a groove part at the root of each attaching flange part, which is protruded from the peripheral part of the main body of the socket, and bending each attaching flange part so that it can be removed. CONSTITUTION:In the top surface of a socket main body 11, grooves 12, in which IC leads are inserted, are formed. Terminals 13 are embedded in the grooves. At the lower part of the socket main body 11, attaching flanges 14 and 14, which are protruded outward from both ends in the longitudinal directions, are provided. A groove 16 having a wedge shaped cross section is provided at the root of each attaching flange 14. A groove 15 is provided at the root of each attaching flange 14. The attaching flanges 14 can be readily bent by a finger 20 so that the flanges can be removed. The socket can be used as a test socket in the state the attaching flanges 14 are provided. When the attaching flanges 14 are removed, the socket can be readily converted into a mounting socket.
申请公布号 JPS61191057(A) 申请公布日期 1986.08.25
申请号 JP19850033106 申请日期 1985.02.20
申请人 TOSHIBA CORP 发明人 YOSHINAGA MOTOAKI
分类号 H01L23/32;H01R33/76 主分类号 H01L23/32
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