| 摘要 |
PURPOSE:To enable a bonding at the central position of a lead by mounting an arithmetic operation section computing the position of indication of optimum bonding in the actual lead to a control system. CONSTITUTION:A control system 2 has a recognition section 21, which recognizes an inner lead 18A and an electrode pad 19A for a semiconductor structure 17 form a signal from a TV camera 20 and outputs the central position of the structure 17 as a recognition data, a memory section 22, which previously memorizes the relative quantities of deviation of the positions of indication of optimum bonding (positions where the center of a capillary must be positioned) to the central position of various inner leads and electrode pads as data, and an arithmetic operation section 23 determining the absolute positions of indication of optimum bonding of the inner lead 18A and the electrode pad 19A in the present semiconductor structure 17 by outputs from the recognition section 21 and the deviation data memorized to the memory section 22. Accordingly, a wire bonder can be automated. |
