| 摘要 |
PURPOSE:To obtain the titled device removing also the moisture among fine wirings, by a method wherein a supply pipe of air or nitrogen gas and a nozzle directed outward are arranged to a rotary spinner above a wafer. CONSTITUTION:The water on the front and back surfaces of a wafer 14 is removed with a centrifugal force by high-speed rotation of a rotary shaft 13. Water among fine wirings, not removable by the centrifugal force of rotation, i.e., the water 20 remaining at the outer peripheral corner of the wiring 19 of 2mum or less on a wafer 18 is blown outside 23 the wiring 19 by spraying air or nitrogen gas 22 out of an outward nozzle 21 installed above the wafer 18, and is completely removed outside further with a centrifugal force. The angle of the outward nozzle 21 can be varied with fine gaps of the wiring and thus adjusted to an angle most suitable to remove the moisture 20 of the wiring 19. |
