发明名称 SOLDERING MACHINE
摘要 PURPOSE:To provide the solder tank of jet type that a soldering body is freely rotatable on a nozzle by providing the vertical movement mechanism to move vertically the solder tank in the solder tank of jet type providing the nozzle to jet melted solder in the inner part. CONSTITUTION:A solder tank 1 is pushed up upto nearly before the ceiling within a short time with rapid climb A by hydraulic cylinder 14 when IC8 is carried in to the upper part of a nozzle 4. The oil feed and discharge quantity for the cylinder 14 is reduced by detecting the level of the solder tank immediately before the jet wave 7 spouted from the nozzle 4 coming into contact with the lead 9 of the IC8, the lifting speed of the tank 1 is changed over to a slow speed climb b and the jet wave 7 is gently brought into contact with the lead 9. The feeding and discharging oil pressure for the cylinder 14 is then locked by detecting the climb level of the solder tank to dip the lead 9 completely into the solder and the tank 1 is stopped c. The revolution speed of a pump 6 is then reduced by controlling a speed change gear, the wave height of the jet wave 7 is dropped and the solder cutting from the lead 9 is performed. Then said hydraulic lock is released, the tank 1 is descended by the slow speed descent (d) by its dead weight and the jet wave 7 is released from the lead 9.
申请公布号 JPS61189869(A) 申请公布日期 1986.08.23
申请号 JP19850030059 申请日期 1985.02.18
申请人 TAMURA SEISAKUSHO CO LTD 发明人 ADACHI MINORU;KIMOTO HISASHI
分类号 B23K1/08;H05K3/34 主分类号 B23K1/08
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