| 摘要 |
PURPOSE:To obtain the titled substrate of markedly low cost which is easily produced with junction secured between a copper foil and a flexible insulation film, by a method wherein the adhesion surface of the copper foil adhered to this film is provided with a gloss copper plated layer. CONSTITUTION:After pre-treatment of a rolled copper foil tape 2, a 4mum gloss copper plated layer 15 is applied to it out of a copper cyanide bath. Thereafter, this is slitted by a 27mm-width and adhered to a 35mm-width polyimide film 1 with an adhesive 14 into a film carrier. Use of a copper foil provided with a gloss copper plate layer on the surface adhered to the flexible insulation film gives a necessary degree of adhesion with this film; besides, even when tin, solder, or silver plating is not done after the fine pattern processing of the copper foil, good junction can be obtained at the lead part of the copper foil in a reductive atmosphere. As a result, it is possible to omit treatments such as coarsing the copper foil adhered to said film, oxidizing it after adhesion, and plating it after patterning. |
