| 摘要 |
PURPOSE:To improve the controllability of etching by forming a resist diffraction grating on a substrate surface by using a metallic mask which has the same period with the resist diffraction grating and then etching the substrate surface by using the resist diffraction grating as a mask. CONSTITUTION:A thin metallic film 7 which is thick enough not to transmit light is formed on a photoresist film 6 on the surface of the substrate 1 and a photoresist film 2 with film thickness corresponding to the period of the diffraction grating is formed by rotating coating. The resist film 2 is exposed by an interference exposing means which uses laser light beams 3 and 3' and developed to form the resist diffraction grating of the resist film 2 on the film 7. The resist 6 is etched through the metallic mask which is formed by etching the film 7 and has the same period with interference fringes, and exposure and development are carried out to form the diffraction grating of the resist on the surface of the substrate 1 with good reproducibility. Consequently, the controllability of the chemical etching is improved.
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