| 摘要 |
PURPOSE:To eliminate short-circuit and assurs a high yield by coating semiconductor element surface and entire part of a plurality of leads extended up to an aperture on an insulated film with a thermosetting type protection resin, executing the primary hardening for the hardness 2H of pencil and then executing the secondary hardening. CONSTITUTION:A plurality of lead wires 2 extended up to an aperture of a flexible insulation film 1 and a gold bump 6 which is electrode of semicoductor element are connected and the surface of semiconductor element 4 and entire part of lead wire 2 are coated with the thermosetting type protection resin 7. This flexible insulation film 1 is a polyimide film and the primary hardening temperature for protection resin is set to 80-130 deg.C. The thermosetting type protection resin has a hardness of 3H in terms of a hardness of pencil after the secondary hardening process. After the primary hardening process, the film of protection resin must have the hardness of 2H or higher in terms of the hardness of pencil. If it is lower than such hardness, the reinforcement for lead wires by film carrier is not sufficient. |
