| 摘要 |
PURPOSE:To limit the production of a crack by providing a slender penetrating hole at the peripheral edge of a semiconductor chip placing unit, and filling a volume contraction unit, thereby absorbing a stress affecting a package by high temperature applied to a printed circuit board at mounting time. CONSTITUTION:A semiconductor device 10 has a slender penetrating hole 14 at a chip placing unit 13a of a lead frame 13, and fills a volume contraction unit 15 mixed with large quantity of air bubbles such as foamable urethane resin in the hole. Accordingly, the unit 13a is provided with a frame portion through couplers 16a-16f at the center, i.e., actually at the outer peripheral edge of the portion for placing a semiconductor chip 12. The frame portion of the peripheral edge of the unit 13a separated by the holes 14a, 14b is deformed wavy by steam pressure to be deformed in the direction of the holes 14a, 14b, i.e., to be pressed inwardly to the unit 13b, and a stress applied to the package is absorbed by pressing foamable urethane resin 15. |
