发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PURPOSE:To obtain the excellent photosensitive composition by incorporating an alpha, beta-unsatd.ethylenic polymer, an alpha, beta-unsatd. ethylene compd. Which is capable of photocross-linking and is liquid at a room temp., a thioxanthone (derivative), a specific P-dialkylamino benzoic acid (ester) and a lophine dimer to the titled composition. CONSTITUTION:The titled composition comprises the resin contg. the alpha, beta-unsatd. ethylenic monomer as a constituting unit, the alpha, beta-unsatd. ethylene compd. Which is capable of photocross-linking and is liquid at the room temp., one or more of thioxanthone or its alkyl derivative or its halogen derivative, and one or more of the lophine kimer shown by formula I wherein R1 and R2 are 1-3 C alkyl, R3 is a hydrogen atom or <=18 C alkyl group, and formula II wherein a phenyl group may be substd. with Cl, F, OCH3. The titled composition is suitable to produce a printed wiring board and can form the photosensitive layer capable of forming the pattern having an excellent adhesion against a substrate and a resolution.
申请公布号 JPS61188533(A) 申请公布日期 1986.08.22
申请号 JP19850030008 申请日期 1985.02.18
申请人 SEKISUI CHEM CO LTD 发明人 ARAKI YASUHIKO;MATSUHI HAJIME;DANJO SHIGERU
分类号 G03C1/00;C08F2/48;G03F7/004;G03F7/031 主分类号 G03C1/00
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