发明名称 THERMOSETTING RESIN COMPOSITION
摘要 PURPOSE:To provide the titled compsn. which has excellent moldability and gives cured articles which have low shrinkage and low elasticity, by blending a specified modifier with a thermosetting resin. CONSTITUTION:0.1-20wt% (based on the entire quantity of blend) modifier for lowering the stress of the resulting cured article, which is a solid thermoplastic elastomer powder having a Mooney viscosity [ML1+4(100 deg.C)] of 3-80 and a softening point of 60-100 deg.C, such as butadiene/acrylonitrile rubber contg. a polar group such as a acrylonitrile group and having a nitrile content of 15-45wt%, a hardener such as phenolic novolak having a softening point of 70-100 deg.C, a curing accelerator such as imidazole and 40-90wt% (based on the entire quantity of compsn.) filler are blended with a thermosetting resin such as epoxy resin contg. at least two epoxy groups per molecule (e.g. bisphenol A epoxy resin).
申请公布号 JPS61188465(A) 申请公布日期 1986.08.22
申请号 JP19850028781 申请日期 1985.02.15
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 OKABE HIDEKI;TORII MUNETOMO
分类号 C08L9/02;C08L1/00;C08L7/00;C08L21/00;C08L23/00;C08L27/00;C08L33/00;C08L33/02;C08L87/00;C08L101/00 主分类号 C08L9/02
代理机构 代理人
主权项
地址