发明名称 EPOXY RESIN COMPOSITION
摘要 PURPOSE:To obtain an epoxy resin composition improved in heat resistance, flexibility, etc., by using a polyepoxy resin obtained by reacting a mixture of a specified dieposy resin and a novolak epoxy resin with a bisphenol and a curing gent for epoxy resin as essential components of the resin composition. CONSTITUTION:A polyepoxy resin (A) and a curing agent (B) for epoxy resin are used as essential components. Component A is a polyepoxy resin of an epoxy equivalent of 200-2,000, obtained by reacting a mixture of a diepoxy resin (a-1) of an epoxy equivalent of 170-800, having a skeleton comprising at lest one selected from among bisphenol A, bisphenol F and tetrabromobisphenol A, and a novolak epoxy resin (a-2) having 2.3-10, on the average, glycidyl groups per molecule with at least one bisphenol (a-3) selected from among bisphenol A, bisphenol F and tetrabromobisphenol A. As component B, any usual curing agent such as an aliphatic or aromatic amine can be used.
申请公布号 JPS61188413(A) 申请公布日期 1986.08.22
申请号 JP19850028309 申请日期 1985.02.18
申请人 DAINIPPON INK & CHEM INC 发明人 EBARA TOSHIHARU;YAMAMOTO MITSURU;OGISHI HIDEO
分类号 C08G59/00;C08G59/20;C08G59/30;C08G59/32 主分类号 C08G59/00
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