| 摘要 |
PURPOSE:To input directly the specified information from an outside to a circuit B (for instance a memory) at a semiconductor device where an output of a circuit A becomes an input of the circuit B for easy and reliable tests such as that of the circuit B and the like by means of a desired test pattern. CONSTITUTION:A buffer circuit 3 is provided as the third circuit between the circuits A1 and B2 in addition to the circuits A1 and B2 (for instance RAM) on a chip 5 which is fitted in a package 6. On an output side of the buffer circuit 3, an input terminal IN2 is provided to input directly the specified information (for instance test information) from the outside to the circuit B2. The above buffer circuit 3 as the third circuit allows an output side of the circuit A1 to be a high impedance and separates electrically an interval between the output side of the circuit A1 and the input side of the circuit B2.
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