| 摘要 |
The invention relates to a power semiconductor module with a plastic casing having clips moulded thereon and a ceramic substrate inserted as a baseplate. Modules of this type are screwed onto a heat sink. The rigid mechanical coupling arising in conventional modules, between the attachment point and the substrate pressing onto the heat sink, may result in fracture of the substrate or inadequate contact to the heat sink. It is proposed to couple the substrate (7) with the housing (1) via a thin lip (5, 17), resulting in more favourable contact conditions. <IMAGE> |
