| 摘要 |
PURPOSE:To plate silver having arbitrary luster simply and stably, by plating silver on material by repeating conduction and nonconduction of electricity thereon by using silver plating liquid. CONSTITUTION:Neutral or alkaline silver plating liquid is used, conduction and nonconduction times of electricity are provided during preset plating time without adding luster agent substantially, and this as one period is repeated by plaural periods in plating time. Furthermore, ratio of electricity conduction time to nonconduction time and periods of these are varied, to control luster degree arbitrarily from high luster to nonluster. Plated film having high luster range obtd. by the method has high tensile strength and elongation ratio and contains no impurites. It is suitable method for s1ilver plating to lead frame made of Cu, Cu alloy, Fe-Ni alloy, etc. as raw material.
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