| 摘要 |
PURPOSE:To impart airtightness, and to miniaturize and thin the titled sealing structure by using an extremely thin flexible insulating film as a sheath protective film, forming the insulating film so as to cover the back of a semiconductor pellet gag-bonded with a film carrier and bonding the insulating film with thermosetting epoxy adhesives, etc. CONSTITUTION:A film carrier 1 to which a metallic wiring 2, an inner lead 8 and an outer lead 9 are shaped is used, and the inner lead 8 and an electrode for a semiconductor pellet 3 are gag-bonded on the metallic wiring 2 side through solder bumps 13 to the film carrier 1. A sheath protective film 10 in which an island 11 is formed to a polyimide film is employed, and thermosetting epoxy adhesives 12 are applied so as to surround the periphery of the island 11, and cured in thickness of the same extent as the semiconductor pellet 3. The film carrier 1 and the sheath protective film 10 are thermocompression- bonded in a facing manner while the semiconductor pellet 3 is pellet-bonded with the island 11, thus sealing the pellet. |
