| 摘要 |
PURPOSE:To obtain a Cu alloy for a semiconductor lead frame having high strength and toughness by casting a Cu alloy consisting of a specified amount of Ti and the balance Cu in an inert or reducing atmosphere, hot working it at a prescribed temp., and carrying out process annealing before finish rolling and final annealing under specified conditions. CONSTITUTION:A Cu alloy consisting of 0.01-2.0wt% Ti and the balance Cu is cast in an inert or reducing atmosphere, hot worked at 800-950 deg.C, and subjected repeatedly to rolling and annealing. At this time, process annealing before finish rolling is carried out at 400-600 deg.C for 30-120min, and final annealing is carried out at 200-450 deg.C. By this method, a Cu alloy having superior strength and toughness and suitable for use as a material for a lead frame can be obtd. |
