METHOD OF PACKING ELECTRONIC PARTS AND A PACK PRODUCED BY THE METHOD,申请号IE19810000807-传众专利搜索

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发明名称	METHOD OF PACKING ELECTRONIC PARTS AND A PACK PRODUCED BY THE METHOD
摘要
申请公布号	IE50941(B1)	申请公布日期	1986.08.20
申请号	IE19810000807	申请日期	1981.04.09
申请人	FUJITSU LIMITED	发明人
分类号	B65D85/86;B65B11/50;B65B31/00;B65D81/20;B65D85/30;H05K13/00;(IPC1-7):H01L21/52;B65D71/00	主分类号	B65D85/86
代理机构		代理人
主权项
地址

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