Improved solder connection between microelectronic chip and substrate and method of manufacture.

摘要

Microelectric chips (10) are electrically connected to underlying substrates (14) by means of elongated solder columns (26) made possible by solder dams at the surface of the substrate, the dams being positioned about at least a portion of the connection pads on the surface. Substantial increases in the size of the matrix of such columns are achieved without exceeding applicable shear strain limits, due to the increased deformation of the connectors made possible by their increased length.