| 摘要 |
For automatically mounting electronic components, such as tubular ceramic capacitors having no leads, in preassigned positions on a printed circuit board, there is employed a template having formed therein depressions arranged in mirror-image relationship to the arrangement of the preassigned mounting positions of the components on the circuit board. The depressions have a depth less than the diameter of each component. Removably mounted on the template is a guide plate having passages formed therethrough in register with the template depressions. The electronic components are chuted into the template depressions through the passages in the guide plate, and the positions or attitudes of the components in the template depressions are corrected by applying mechanical vibrations to the superposed template and guide plate, preferably while the latter are being tilted. Then, with the guide plate removed from over the template, a printed circuit board having an adhesive applied to selected surface regions thereof are placed over the template, thereby causing adhesion of the components to the circuit board. After separation of the circuit board from the template, the electrodes of the components are soldered to the conductive pattern on the circuit board. |
