发明名称 |
FLOTATION METHOD FOR ORIENTING CHIPS IN THE MANUFACTURE OF SURFACE COVERING, AND RESULTING PRODUCT |
摘要 |
A substantially non-overlapping tightly packed layer of plastic chips is formed and attached to the surface of a substrate by a method in which the chips are dispersed onto the surface of a liquid, flowing from a first location to a second location. The rate of flow of the surface of the liquid is reduced at the second location to cause the chips to pack together in a single-chip-thickness layer. The layer of chips is then removed from the liquid by passing a porous web upward at an angle from below the liquid surface through the chip layer-liquid interface. The chip layer is then transferred to a heat-sensitive transparent adhesive coating on a suitable prepared substrate and secured thereon by means of heat and pressure. A resinous wear layer which is transparent after fusion is then applied. Prior to fusion of the wear layer, it may be passed beneath a smoothing blade or, if a more embossed surface texture is desired, beneath an air knife to move some of the resinous wear layer material from between the chips onto the surfaces thereof. |
申请公布号 |
GB2136318(B) |
申请公布日期 |
1986.08.20 |
申请号 |
GB19840005792 |
申请日期 |
1984.03.06 |
申请人 |
* ARMSTRONG WORLD INDUSTRIES INC |
发明人 |
TIMOTHY DAVID * COLYER;DARRYL LAMAR * SENSENIG |
分类号 |
B32B3/14;B32B3/18;B32B27/14;B32B33/00;B32B37/00;B32B43/00;D06N7/00;(IPC1-7):B32B5/16;B05D1/38;B32B7/00 |
主分类号 |
B32B3/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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