发明名称 MANUFACTURE OF METALLIC SUBSTRATE FOR THIN FILM BATTERY
摘要 PURPOSE:To obtain the titled substrate with a smooth surface and without defects by a method wherein the surface of a plate of stainless steel or cold rolled steel is plated with only Ni or Ag or with the lamination to a required thickness; then, this plate is cold-rolled. CONSTITUTION:Both surfaces of a 0.3mm. or less plate of stainless steel or cold rolled steel are plated with one of Ni and Ag. Either lamination plating on the base of 5mum or less or the lamination of different kinds of metal is available. However, the plated surface is reduced to a thickness of 40mum or less which is of the degree that surface eaves are not exposed after mirror finish. Next, if the plated surface has the unevenness of 0.7mm. or more, cold-rolling is carried out at a press-down rate of 3-40%. Otherwise, before or after or before and after cold- rolling, on annealing at 500-1,150 deg.C for 10sec-3hr for Ni plating or at 300- 950 deg.C for Ag plating, the strong adhesion of plating can be achieved. This construction can eliminate inner defects and pin-holes and the titled substrate with a smooth surface, can be obtained.
申请公布号 JPS60233868(A) 申请公布日期 1985.11.20
申请号 JP19840090005 申请日期 1984.05.04
申请人 SUMITOMO TOKUSHIYU KINZOKU KK 发明人 HASHIMOTO AKIO
分类号 H01M4/68;H01L31/04;H01L31/18;H01M4/82 主分类号 H01M4/68
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