| 摘要 |
PURPOSE:To enable to perform the desired heat radiation from a semiconductor integrated circuit by a method wherein the pulse signal to be outputted from the pulse signal generator is rectified, the current obtainable is made to flow on the metal wiring and part of the metal wiring and the bonding pad are coupled together by the element for heat radiation, which is capable of intercepting DC current. CONSTITUTION:When a pulse train is made to generate by a pulse signal generator 3, the potential of the mutual connecting point 1a of diodes 1 and 1 is made to fluctuate up and down by a coupling of the pulse signal generator 3 and the mutual connecting point 1a through a capacitor 4 and current (i) makes the round of a metal wiring 2 to the polarity direction of the diodes 1 and 1 and runs in a DC manner. In this case, the electrons or the positive holes, which are turned into the current (i), absorb the heat in the interior of the chip and the electrons or the positive holes emit the heat to be collected in the interior of the chip to a pad 5 through a capacitor 6. The heat to be emitted to the pad 5 is emitted outside the integrated circuit package through the bonding wires and the external pins, which have a good thermal conductivity. At the same time as this, the heat in the interior of the chip is emitted outside through the package. By this way, as the heat in the interior of the chip can be emitted efficiently and actively through the external terminals, the temperature in the interior of the chip is dropped, thereby enabling to contrive the improvement of the characteristics of the semiconductor integrated circuit device and the characteristics of the semiconductor integrated circuit. |
