发明名称 THIN FILM CIRCUIT AND MANUFACTURE THEREOF
摘要 <p>A thin-film metal conductor system using a zirconium adhesion layer is disclosed. The system is formed by first plating a layer of zirconium over a substrate material and any electrical components, such as resistors, which are fixed on the substrate. A conductive layer is then deposited over those portions of the zirconium layer which are to provide conductive pathways. The resulting unit is thermally treated in an oxidizing environment, such as air, to oxidize the exposed portions of the zirconium layer and thereby form regions of zirconium oxide. The zirconium oxide is nonconductive and protects underlying components from moisture and physical abrasion.</p>
申请公布号 JPS61185951(A) 申请公布日期 1986.08.19
申请号 JP19860019987 申请日期 1986.01.31
申请人 TEKTRONIX INC 发明人 AARU AARU HERUDAAMAN;ROBAATO II HOUMUZU;ROBAATO AARU JIMAAMAN
分类号 H01C7/00;H01L21/3205;H01L21/48;H01L23/498;H05K1/03;H05K1/09;H05K3/38;H05K3/46 主分类号 H01C7/00
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