Textured carbon surfaces on copper by sputtering

摘要

A very thin layer of highly textured carbon is applied to a copper surface by a triode sputtering process. A carbon target 10 and a copper substrate 12 are simultaneously exposed to an argon plasma 14 in a vacuum chamber. The resulting carbon surface is characterized by a dense, random array of needle-like spires or peaks which extend perpendicularly from the copper surface. The coated copper is especially useful for electrode plates in multistage depressed collectors.