| 摘要 |
A resin solution is made from (1) an adhesive resin, such as a polyester resin containing an adhesive component, (2) a mica bonding resin such as an epoxy resin containing both cycloaliphatic epoxy and novolac epoxy, and (3) latent curing agent for the mica bonding resin; where the resin solution is used to coat a mica-backing composite, to provide, when dried at a time and temperature only to remove solvent, a mica bond mica tape useful for wrapping electrical coils without splitting or loss of mica.
|
