| 摘要 |
A non-photosensitive transfer resist sheet material comprises in sequence (a) a carrier support (b) a release layer (c) a flexible, water-insoluble, aqueous-alkaline-soluble, non-photosensitive resist layer comprising a thermoplastic organic polymer, wherein said resist is able to adhere to a surface against which it is pressed at a temperature above 60 DEG C. The resist is useful as a protective layer in etching and coating processes in electronic circuitry technology. |
