发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To contrive the improvement of the humidity resistance and the thermal-shock resistance of a lead frame by a method wherein recessed parts are respectively provided on the surfaces and back of the tab leads and inner leads of the lead frame in the width direction of both leads, and at the same time, innumerable recessed parts are provided on the back of the mounting part of the lead frame. CONSTITUTION:First recessed parts 21, which are respectively provided in the surfaces of the tab leads 4 and 4 of a lead frame 1 and the surfaces of the inner leads 5... of the lead frame 1, are provided in the width direction of the leads 4 and 5 and in a column form. Moreover, second recessed parts 22... are provided on the back of the tab leads and the inner leads in the width direction of the leads 4 and 5 and in a column form, and furthermore, innumerable third recessed parts 23... are provided on the back of the mounting part 3 of the lead frame 1. As the lead frame is made in the structure, wherein the first recessed parts 21 and the second recessed parts 22 are respectively provided on the surfaces and the back of the leads 4 and 5, water is hard to permiate a resin layer 7, and furthermore, as the adhesion of the resin layer 7 and the lead frame 1 is high, the humidity resistance of the lead frame can be made to improve. Moreover, as the innumerable third recessed parts 23... are provided in the back surface of the mounting parts 3..., the thermal stress is hard to concentrate on the lead frame, thereby enabling to improve the thermal schock resistance of the lead frame.
申请公布号 JPS61185955(A) 申请公布日期 1986.08.19
申请号 JP19850025675 申请日期 1985.02.13
申请人 TOSHIBA CORP 发明人 BABA ISAO
分类号 H01L23/50;H01L23/28;H01L23/495 主分类号 H01L23/50
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