发明名称 |
Curable compositions based on epoxy resins |
摘要 |
A solvent-free curable composition has a long shelf life and consists of A 100 parts by weight of an epoxy resin and B from 10 to 100 parts by weight of, as a curing agent for the epoxy resin, an aromatic diamine containing <IMAGE> groups, with or without C from 0.01 to 5 parts by weight of an accelerator, the curing agent for the epoxy resin being finely dispersed in the latter and preferably having a particle size of less than 10 mu m. The preferred epoxy resin curing agent is 4,4'-diaminodiphenyl ketone. The curable composition is used in particular for the preparation of fiber-reinforced materials.
|
申请公布号 |
US4607069(A) |
申请公布日期 |
1986.08.19 |
申请号 |
US19850751389 |
申请日期 |
1985.07.03 |
申请人 |
BASF AKTIENGESELLSCHAFT |
发明人 |
TESCH, HELMUT;HEYM, MANFRED;DOERFLINGER, WALTER;STUTZ, HERBERT;NEUMANN, PETER;NISSEN, DIETMAR;SCHAEFER, GERHARD |
分类号 |
C08G59/00;C08G59/18;C08G59/50;C08J3/24;C09D163/00;C09J163/00;(IPC1-7):C08G59/50 |
主分类号 |
C08G59/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|