发明名称 Curable compositions based on epoxy resins
摘要 A solvent-free curable composition has a long shelf life and consists of A 100 parts by weight of an epoxy resin and B from 10 to 100 parts by weight of, as a curing agent for the epoxy resin, an aromatic diamine containing <IMAGE> groups, with or without C from 0.01 to 5 parts by weight of an accelerator, the curing agent for the epoxy resin being finely dispersed in the latter and preferably having a particle size of less than 10 mu m. The preferred epoxy resin curing agent is 4,4'-diaminodiphenyl ketone. The curable composition is used in particular for the preparation of fiber-reinforced materials.
申请公布号 US4607069(A) 申请公布日期 1986.08.19
申请号 US19850751389 申请日期 1985.07.03
申请人 BASF AKTIENGESELLSCHAFT 发明人 TESCH, HELMUT;HEYM, MANFRED;DOERFLINGER, WALTER;STUTZ, HERBERT;NEUMANN, PETER;NISSEN, DIETMAR;SCHAEFER, GERHARD
分类号 C08G59/00;C08G59/18;C08G59/50;C08J3/24;C09D163/00;C09J163/00;(IPC1-7):C08G59/50 主分类号 C08G59/00
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